News

Advanced Materials just published our work on Low Thermal Conductivity through Dense Particle Packings with Optimum Disorder. The thermal insulation capability of particulate materials can be strongly enhanced by the right degree of disorder. Using binary colloidal assemblies of two differently sized particles as a model platform, a reduction of ≈50% is obtained. These results are of general importance for many particulate and heterostructured materials and will help to conceive improved device layouts with more reliable heat dissipation or conservation properties in the future. The full details can be found in doi: https://doi.org/10.1002/adma.201704910